Semiconductor device and method for fabricating semiconductor device
US7923839B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2009 |
| Grant date | Apr 12, 2011 |
| Priority date | — |
| Expiry date | Oct 9, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/1089
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a contact plug electrically connected to a semiconductor substrate; a first barrier metal film with a columnar crystal structure arranged in contact with the semiconductor substrate at least on a bottom surface side of the contact plug; an amorphous film made of a material of the first barrier metal film arranged in contact with the first barrier metal film at least on the bottom surface side of the contact plug; a second barrier metal film made of a material identical to that of the first barrier metal film and having a columnar crystal structure, at least a portion of which is arranged in contact with the amorphous film on the bottom surface side and a side surface side of the contact plug; and a dielectric film arranged on the side surface side of the contact plug.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.