Patent · US Active

Integrated circuit device including a contactless integrated circuit inlay

US7926728B2 · kind B2 · utility

3Cited by

8References

25Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Peter Raggam · Friesach, AT
Thomas Grieshofer · Rottenmann, AT

Key dates

Filing date	Oct 31, 2007
Grant date	Apr 19, 2011
Priority date	—
Expiry date	Oct 28, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/4902
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

Embodiments provide an integrated circuit device including a contactless integrated circuit inlay. The device includes a substrate, an integrated circuit coupled to the substrate, and a coil electrically coupled to the integrated circuit and coupled to the substrate. The coil includes a first conductive line disposed in multiple turns on the substrate and a second conductive line disposed in multiple turns on the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.