Method of polishing a target surface
US7927187B2 · kind B2 · utility
6Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2008 |
| Grant date | Apr 19, 2011 |
| Priority date | — |
| Expiry date | Nov 2, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A circular polishing pad has grooves formed on the surface in a spiral pattern with its center point offset from the center of the pad. The spiral pattern is an Archimedean spiral pattern or a parabolic spiral pattern. A target object is polished by using such a polishing pad without oscillating the platen to which the polishing pad is pasted or the polishing head that holds the target object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.