Plasma processing apparatus
US7927455B2 · kind B2 · utility
8Cited by
21References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2005 |
| Grant date | Apr 19, 2011 |
| Priority date | — |
| Expiry date | Nov 25, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F71/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing apparatus including a sealable chamber that is sealable, a gas supply section that supplies a reactive material gas into the chamber, and a plurality of cathode and anode electrode pairs provided within the chamber, connected to an external power supply, and producing plasma discharges through the material gas, respectively, wherein the plurality of cathode and anode electrode pairs are provided at a distance from one another at which the plasma discharges are prevented from interfering with one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.