Silicon heat spreader mounted in-plane with a heat source and method therefor
US7928548B2 · kind B2 · utility
23Cited by
11References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2008 |
| Grant date | Apr 19, 2011 |
| Priority date | — |
| Expiry date | Apr 29, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat spreader attached to a heat source that includes a semiconductor chip includes a silicon structure that provides a plurality of heat flux paths, including a lateral, in-plane heat flux path. The heat spreader is mounted in-plane with the heat source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.