Integrated circuit devices with multi-dimensional pad structures
US7928549B2 · kind B2 · utility
6Cited by
27References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2006 |
| Grant date | Apr 19, 2011 |
| Priority date | — |
| Expiry date | Oct 18, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Integrated circuits with multi-dimensional pad structures are provided. An exemplary embodiment of an integrated circuit device with multi-dimensional pad structures comprises an integrated circuit (IC) stack structure comprising a plurality of device layers, wherein one of the devices comprise a first pad exposed by an edge surface thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.