Inventor · Hsinchu, TW

Hai-Ching Chen

181Patents
10h-index
70Co-inventors
83Inventor score

Filing activity: May 26, 1987 → Jan 23, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US9134633B2 System and method for dark field inspection Physics 60 Active
US4970504A Security system Physics 51 Expired
US9036956B2 Method of fabricating a polymer waveguide Physics 25 Active
US9177797B2 Lithography using high selectivity spacers for pitch reduction Electricity 25 Active
US9659864B2 Method and apparatus for forming self-aligned via with selectively deposited etching stop layer Electricity 21 Active
US4812841A Computer-controlled password lock Physics 18 Expired
US9773676B2 Lithography using high selectivity spacers for pitch reduction Electricity 15 Active
US5004076A Apparatus for controlling an electric elevator Performing Operations; Transporting 13 Expired
US9041015B2 Package structure and methods of forming same Electricity 13 Active
US8264066B2 Liner formation in 3DIC structures Electricity 12 Active
US8440564B2 Schemes for forming barrier layers for copper in interconnect structures Electricity 9 Active
US9941157B2 Porogen bonded gap filling material in semiconductor manufacturing Electricity 8 Active
US7964496B2 Schemes for forming barrier layers for copper in interconnect structures Electricity 7 Active
US8446012B2 Interconnect structures Electricity 7 Active
US8976833B2 Light coupling device and methods of forming same Electricity 7 Active
US9818690B2 Self-aligned interconnection structure and method Electricity 7 Active
US7682963B2 Air gap for interconnect application Electricity 7 Active
US9230911B2 Interconnect structure and method of forming the same Electricity 6 Active
US8729703B2 Schemes for forming barrier layers for copper in interconnect structures Electricity 6 Active
US7928549B2 Integrated circuit devices with multi-dimensional pad structures Electricity 6 Active
US8735278B2 Copper etch scheme for copper interconnect structure Electricity 6 Active
US10008382B2 Semiconductor device having a porous low-k structure Electricity 5 Active
US10014175B2 Lithography using high selectivity spacers for pitch reduction Electricity 5 Active
US8232201B2 Schemes for forming barrier layers for copper in interconnect structures Electricity 5 Active
US9335473B2 Package structure and methods of forming same Electricity 5 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.