MEMS interconnection pins fabrication on a reusable substrate for probe card application
US7928751B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 18, 2009 |
| Grant date | Apr 19, 2011 |
| Priority date | — |
| Expiry date | Jul 20, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49105
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A Micro-Electro-Mechanical-Systems (MEMS) interconnection pin is fabricated on a sacrificial layer, which is formed on a conductive layer and a substrate. The MEMS interconnection pin has a pin base attached to a frame that has direct contact to the conductive layer. The sacrificial layer is then removed, at least partially, to detach the MEMS interconnection pin from the substrate. In one embodiment, the MEMS interconnection pin has a pin base, two springs extending out from two different surfaces of the pin base, and a tip portion attached to each spring. The tip portions include one or more contact tips to make contact to conductive subjects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.