Heat dissipation apparatus
US7929304B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 8, 2009 |
| Grant date | Apr 19, 2011 |
| Priority date | — |
| Expiry date | Aug 23, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. The fan is configured to generate airflow through the fins in such a manner that airflow flows from a second side of the fins to a first side of the fins. A deflecting member is mounted on the first side of the fins for deflecting airflow from the fan towards the second of the two heat sources.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.