Jeng-Da Wu
28Patents
6h-index
22Co-inventors
65Inventor score
Filing activity: Aug 13, 2003 → May 18, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6864168B2 | Bump and fabricating process thereof | Electricity | 16 | Expired |
| US7760498B2 | Electronic apparatus with air guiding element | Electricity | 13 | Active |
| US7199479B2 | Chip package structure and process for fabricating the same | Electricity | 12 | Expired |
| US6819002B2 | Under-ball-metallurgy layer | Electricity | 10 | Expired |
| US7835149B2 | Computer enclosure with airflow guide | Physics | 8 | Active |
| US7407833B2 | Process for fabricating chip package structure | Electricity | 6 | Expired |
| US7675753B2 | Mounting apparatus for heat sink | Electricity | 6 | Active |
| US7929304B2 | Heat dissipation apparatus | Electricity | 4 | Active |
| US7663063B2 | Circuit board with improved ground plane | Electricity | 4 | Active |
| US7482204B2 | Chip packaging process | Electricity | 3 | Active |
| US6891274B2 | Under-bump-metallurgy layer for improving adhesion | Electricity | 3 | Expired |
| US7335982B2 | Chip package structure and chip packaging process | Electricity | 2 | Expired |
| US8256111B2 | Circuit board layout method | Emerging Cross-Sectional Technologies | 2 | Active |
| US7996169B2 | Method and apparatus for compensating S-parameters of passive circuits | Physics | 2 | Active |
| US7447039B2 | Motherboard configured to minimize or prevent damage to a chip thereon | Emerging Cross-Sectional Technologies | 2 | Active |
| US7633169B2 | Chip package structure | Electricity | 1 | Active |
| US6972489B2 | Flip chip package with thermometer | Electricity | 1 | Expired |
| US8154879B2 | Motherboard | Electricity | 1 | Active |
| US7864536B2 | Circuit board assembly | Electricity | 1 | Active |
| US7606119B2 | Objective lens actuator | Physics | 1 | Active |
| US7973244B2 | Printed circuit board | Electricity | 1 | Active |
| US7042078B2 | Semiconductor package | Electricity | 0 | Expired |
| US7763817B2 | Button assembly | Physics | 0 | Active |
| US8154125B2 | Chip package structure | Electricity | 0 | Active |
| US9693142B2 | Housing of electronic device and speaker | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.