Patent · US Active

Method and apparatus for determining the stability of an electroless plating bath

US7932094B2 · kind B2 · utility

0Cited by

4References

12Claims

0Family size

Assignee

ECI TECHNOLOGY, INC.

Inventors

Eugene Shalyt · Hackettstown, US
Semyon Aleynik · Tenafly, US
Peter Bratin · Great Neck, US

Key dates

Filing date	Aug 7, 2008
Grant date	Apr 26, 2011
Priority date	—
Expiry date	Dec 16, 2028

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC23C18/1683
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

The stability of an electroless plating bath for depositing a metal (e.g., nickel) is determined by titrating a sample of the plating bath with a titrant comprising ions of a catalytic metal (e.g., palladium) and detecting hydrogen released at the titration endpoint. The quantity of titrant required to attain the endpoint provides a measure of the stability of the electroless plating bath.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.