Patent · US Active

Singulated semiconductor package

US7932587B2 · kind B2 · utility

5Cited by

7References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventor

Thomas Lehmann · Langenselbold, DE

Key dates

Filing date	Sep 7, 2007
Grant date	Apr 26, 2011
Priority date	—
Expiry date	Nov 11, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/18301
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device includes a singulated semiconductor package having a leadframe, a chip electrically coupled to the leadframe, encapsulating material covering the chip and a portion of the leadframe, and a material layer disposed over opposing ends of the leadframe. The leadframe includes a first face and an opposing second face, the first and second faces extending between opposing ends of the leadframe, where the second face configured to electrically couple with a circuit board. The chip is electrically coupled to the first face. The encapsulating material covers the chip and the first face of the leadframe. The material layer is configured to improve solderability of the singulated semiconductor package to the circuit board.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.