Connection between a semiconductor housing and a base plate comprising a passage opening for fastening to a heat sink
US7932598B2 · kind B2 · utility
0Cited by
17References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 20, 2005 |
| Grant date | Apr 26, 2011 |
| Priority date | — |
| Expiry date | Nov 8, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module has a housing (2) and a metal base plate (3). A reliable yet easily producible force-transmitting connection between a semiconductor module and an external heat sink is provided by a mechanical pressure-proof counterpart (4) which is incorporated into the housing (2) and forms a firm connection (14) with a pressure-proof connecting element (10) on the base plate side. The connection is provided with a passage opening (12) for fastening the semiconductor module to the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.