Microdisplay and interface on a single chip
US7932875B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2010 |
| Grant date | Apr 26, 2011 |
| Priority date | — |
| Expiry date | Jun 14, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG09G2340/0407
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microdisplay having interface circuitry on the same silicon backplane to allow it to receive digital images and video in a variety of formats and convert same to field sequential color signals for generation of full color images. It includes column data processors having a comparator for each block of N-columns of pixels. Image data is double-buffered in SRAM memory cells located beneath the pixel electrodes, but not within each pixel. The stored data is logically associated with each pixel via the column data processors. Image compression is accomplished by converting RGB data to a variant of YUV data and sampling the color components of the converted data less frequently than the luminance components. The SRAM image buffer consumes a reduced amount of power. A temperature compensation scheme allows the temperature of the microdisplay to be sensed and the drive voltage to the pixel electrodes to be varied in response thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.