Micro-optical device packaging system
US7936033B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 29, 2008 |
| Grant date | May 3, 2011 |
| Priority date | — |
| Expiry date | Oct 28, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/804
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.