Method for making a micro-fluid ejection device

US7938975B2 · kind B2 · utility

Assignee

• Lexmark International, Inc. · US

Inventors

• John Krawczyk · Richmond, US
• James Mrvos · Lexington, US
• Girish S. Patil · Lexington, US
• Jason Vanderpool · Lexington, US
• Brian Hart · Georgetown, US
• Christopher Money · Lexington, US
• Jeanne Marie Saldanha Singh · Lexington, US
• Karthik Vaideeswaran · Lexington, US

Key dates

• Filing date: Jul 19, 2007
• Grant date: May 10, 2011
• Expiry date: Mar 8, 2030

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B2201/052
• WIPO field: Textile and paper machines
• WIPO sector: Mechanical engineering

Abstract

A method of etching a semiconductor substrate. The method includes the steps of applying a photoresist etch mask layer to a device surface of the substrate. A select first area of the photoresist etch mask is masked, imaged and developed. A select second area of the photoresist etch mask layer is irradiated to assist in post etch stripping of the etch mask layer from the select second area. The substrate is etched to form fluid supply slots through a thickness of the substrate. At least the select second area of the etch mask layer is removed from the substrate, whereby mask layer residue formed from the select second area of the etch mask layer is significantly reduced.