Method to provide a layer with uniform etch characteristics

US7939131B2 · kind B2 · utility

Assignee

• Molecular Imprints, Inc. · US

Inventors

• Frank Y. Xu · Round Rock, US
• Christopher J. Mackay · Austin, US
• Pankaj Lad · Austin, US
• Ian McMackin · Austin, US
• Van Nguyen Truskett · Austin, US
• Wesley D. Martin · Elgin, US
• Edward Brian Fletcher · Austin, US
• David C. Wang · Austin, US
• Nicholas A. Stacey · Austin, US
• Michael Watts · Austin, US

Key dates

• Filing date: Aug 16, 2004
• Grant date: May 10, 2011
• Expiry date: Aug 24, 2030

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/1386
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

The present invention includes a method and a composition to form a layer on a substrate having uniform etch characteristics. To that end, the method includes controlling variations in the characteristics of a solid layer, such etch characteristics over the area of the solid layer as a function of the relative rates of evaporation of the liquid components that comprise the composition from which the solid layer is formed.