Flip-flop semiconductor device packaging using an interposer
US7939371B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 30, 2007 |
| Grant date | May 10, 2011 |
| Priority date | — |
| Expiry date | Sep 19, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package, a method of fabricating a semiconductor device package and a method of testing an integrated circuit utilizing a semiconductor device package are disclosed. Embodiments create a flip-flop semiconductor device package by coupling multiple leadfingers to conductive pads of a semiconductor device using an interposer with electrically conductive traces. The semiconductor device may be positioned in a face-up orientation between the leadfingers such that a single surface of the interposer may couple to both the semiconductor device and the leadfingers. The flip-flop package offers improved signaling properties, durability, reliability, and package density at reduced cost given that the interposer is configurable, the traces offer more reliable and durable interconnections, the interposer enables use of a smaller semiconductor device with a higher density conductive pad arrangement to decrease package density, and the interposer is relatively inexpensive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.