Patent · US Active

Method of improving intrinsic gettering ability of wafer

US7939432B2 · kind B2 · utility

6Cited by
7References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 15, 2008
Grant dateMay 10, 2011
Priority date
Expiry dateJul 14, 2029

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/3225
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method of improving the intrinsic gettering ability of a wafer is described. A first annealing step is performed to the wafer at a first temperature in an atmosphere containing at least one of oxygen gas and nitrogen gas. A second annealing step is performed to the wafer, at a second temperature higher than the first temperature, in the atmosphere.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.