Method of improving intrinsic gettering ability of wafer
US7939432B2 · kind B2 · utility
6Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2008 |
| Grant date | May 10, 2011 |
| Priority date | — |
| Expiry date | Jul 14, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3225
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of improving the intrinsic gettering ability of a wafer is described. A first annealing step is performed to the wafer at a first temperature in an atmosphere containing at least one of oxygen gas and nitrogen gas. A second annealing step is performed to the wafer, at a second temperature higher than the first temperature, in the atmosphere.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.