Patent · US Active

Plasma processing chamber with guard ring for upper electrode assembly

US7939778B2 · kind B2 · utility

18Cited by

5References

20Claims

0Family size

Assignee

Lam Research Corporation · US

Inventors

Dean J. Larson · Pleasanton, US
Daniel Arthur Brown · Dublin, US
Saurabh Ullal · Berkeley, US

Key dates

Filing date	Jan 22, 2009
Grant date	May 10, 2011
Priority date	—
Expiry date	Jul 19, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01J37/32568
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A plasma processing chamber, which includes an upper electrode assembly, a lower electrode assembly, and a plasma confinement assembly. The upper electrode assembly includes an upper electrode, a backing member, the backing member attachable to an upper surface of the upper electrode, and a guard ring surrounding an outer surface of the backing member and located above the upper surface of the upper electrode, wherein the guard ring is configured to provide an inner gap between the outer surface of the backing member and an inner periphery of the guard ring. The lower electrode assembly is adapted to receive a semiconductor substrate. The plasma confinement assembly is separated from an outer periphery of the upper electrode and the backing member by the guard ring.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.