Semiconductor device and manufacturing method thereof
US7939925B2 · kind B2 · utility
1Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2008 |
| Grant date | May 10, 2011 |
| Priority date | — |
| Expiry date | Jul 31, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package having a molding unit that seals bonding wires connected to electrode pads of a semiconductor chip is provided with through electrode units comprising bonding wires embedded therein and penetrating the molding unit. A leading end of the respective through electrode units is exposed from an upper surface of the molding unit and a lower surface of the molding unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.