Thin-film bulk acoustic resonators having perforated bodies that provide reduced susceptibility to process-induced lateral dimension variations
US7939990B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2009 |
| Grant date | May 10, 2011 |
| Priority date | — |
| Expiry date | Sep 19, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2009/241
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Micro-electromechanical acoustic resonators include a resonator body suspended over a substrate. The resonator body may have a single perforation therein, which may extend substantially or completely therethrough. The resonator body may also be configured to have a center-of-mass within an interior of the perforation and/or a nodal line that overlaps the perforation. A perimeter and depth of the single perforation can be configured to reduce a susceptibility of the acoustic resonator to process-induced variations in resonant frequency relative to an otherwise equivalent resonator that omits the single perforation. In other embodiments, the resonator body may have multiple perforations therein that extend along a nodal line of the resonator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.