Rigid-backed, membrane-based chip tooling
US7942182B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2006 |
| Grant date | May 17, 2011 |
| Priority date | — |
| Expiry date | Sep 5, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S2301/176
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for use with multiple individual chips having a rigid plate, and a deformable membrane located on the plate, the deformable membrane having a thickness sufficient to allow the deformable membrane to peripherally conform to each of the individual multiple chips irrespective of any difference in height among the multiple individual chips and to prevent each of the multiple individual chips from moving in a lateral direction, the deformable membrane being configured to uniformly transfer a vertical force, applied to the rigid plate, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded during a connect and release cycle without causing damage to the individual chips or bonding surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.