Method for self-assembling microstructures
US7943052B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2007 |
| Grant date | May 17, 2011 |
| Priority date | — |
| Expiry date | Feb 14, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15165
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for self-assembling a plurality of microstructures onto a substrate comprising using a bonding material to make the microstructure assembled onto the substrate by a physical attraction force. The microstructures are self-aligned with the substrate, and further permanently fixed on and electrical connection with the substrate by the solder bumps between the microstructures and the substrate, which is formed by the solder bumps via reflow process. There is no need for the using of the conventional pick-and-place device in the present method. The present method could be applied to light emitting diodes, RFID tags, micro-integrated circuits or other types of microstructures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.