Integrated millimeter wave antenna and transceiver on a substrate
US7943404B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2008 |
| Grant date | May 17, 2011 |
| Priority date | — |
| Expiry date | Apr 4, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q9/28
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip integrating a transceiver, an antenna, and a receiver is provided. The transceiver is formed on a front side of a semiconductor substrate. At least one through substrate via provides electrical connection between the transceiver and the backside of the semiconductor substrate. The antenna, which is connected to the transceiver, is formed in a dielectric layer on the front side. The reflector plate is connected to the through substrate via, and is formed on the backside. The separation between the reflector plate and the antenna is about the quarter wavelength of millimeter waves, which enhances radiation efficiency of the antenna. An array of through substrate trenches may be formed and filled with a dielectric material to reduce the effective dielectric constant of the material between the antenna and the reflector plate, thereby reducing the wavelength of the millimeter wave and enhance the radiation efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.