Hanyi Ding
112Patents
9h-index
75Co-inventors
79Inventor score
Filing activity: Jun 30, 2003 → Mar 30, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8519892B2 | Integrated millimeter wave antenna and transceiver on a substrate | Electricity | 196 | Active |
| US7323948B2 | Vertical LC tank device | Electricity | 24 | Expired |
| US7564319B2 | Vertical LC tank device | Electricity | 16 | Active |
| US8035198B2 | Through wafer via and method of making same | Electricity | 15 | Active |
| US7061359B2 | On-chip inductor with magnetic core | Electricity | 15 | Expired |
| US8789003B1 | Millimeter wave phase shifters using tunable transmission lines | Physics | 14 | Active |
| US8193878B2 | Structure, structure and method for providing an on-chip variable delay transmission line with fixed characteristic impedance | Electricity | 13 | Active |
| US9171121B2 | Method, structure, and design structure for a through-silicon-via Wilkinson power divider | Electricity | 12 | Active |
| US7271693B2 | On-chip inductor with magnetic core | Electricity | 10 | Expired |
| US8188808B2 | Compact on-chip branchline coupler using slow wave transmission line | Electricity | 9 | Active |
| US8518787B2 | Through wafer vias and method of making same | Electricity | 9 | Active |
| US8138876B2 | On-chip integrated voltage-controlled variable inductor, methods of making and tuning such variable inductors, and design structures integrating such variable inductors | Emerging Cross-Sectional Technologies | 8 | Active |
| US7071530B1 | Multiple layer structure for substrate noise isolation | Electricity | 8 | Expired |
| US8232115B2 | Test structure for determination of TSV depth | Electricity | 8 | Active |
| US7759243B2 | Method for forming an on-chip high frequency electro-static discharge device | Electricity | 8 | Active |
| US7943404B2 | Integrated millimeter wave antenna and transceiver on a substrate | Electricity | 8 | Active |
| US7812694B2 | Coplanar waveguide integrated circuits having arrays of shield conductors connected by bridging conductors | Electricity | 7 | Active |
| US8680689B1 | Coplanar waveguide for stacked multi-chip systems | Electricity | 7 | Active |
| US7645675B2 | Integrated parallel plate capacitors | Electricity | 7 | Expired |
| US8138857B2 | Structure, structure and method for providing an on-chip variable delay transmission line with fixed characteristic impedance | Electricity | 7 | Active |
| US8232920B2 | Integrated millimeter wave antenna and transceiver on a substrate | Electricity | 7 | Active |
| US9054793B2 | Structure, system and method for device radio frequency (RF) reliability | Physics | 7 | Active |
| US8779870B2 | Low phase variation CMOS digital attenuator | Electricity | 7 | Active |
| US8028406B2 | Methods of fabricating coplanar waveguide structures | Emerging Cross-Sectional Technologies | 6 | Active |
| US8514028B2 | Load tolerant voltage controlled oscillator (VCO), IC and CMOS IC including the VCO | Electricity | 6 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.