Method of cutting PCBS
US7943490B2 · kind B2 · utility
1Cited by
2References
15Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 19, 2008 |
| Grant date | May 17, 2011 |
| Priority date | — |
| Expiry date | Aug 16, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1383
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method of cutting PCB module using a laser. The method includes steps of: providing a coverlay film, the coverlay film including at least one opening defined therein; attaching the coverlay film onto the PCB module such that the through holes of the PCB module are covered by the coverlay film and the laser cutting area thereof is exposed via the at least one opening; applying a laser beam to the exposed laser cutting area of the PCB module to cut the PCB module; and removing the coverlay film. A high positioning precision of the PCB module and better cutting result can be obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.