Patent · US Active

Power semiconductor module

US7944033B2 · kind B2 · utility

0Cited by

9References

25Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Benedikt Specht · Lennestadt, DE
Gottfried Ferber · Warstein, DE

Key dates

Filing date	Oct 18, 2007
Grant date	May 17, 2011
Priority date	—
Expiry date	Apr 18, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An apparatus includes a housing with a plurality of restraining elements and at least one supporting element. A cover is elastically deformed by the plurality of restraining elements and the at least one supporting means. At least one substrate carrying at least one semiconductor chip is provided within the housing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.