Semiconductor device having improved contact interface reliability and method therefor
US7944043B1 · kind B1 · utility
13Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2008 |
| Grant date | May 17, 2011 |
| Priority date | — |
| Expiry date | Jul 29, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package has an insulative layer having at least one channel formed on a first surface thereof. A conductive pattern conforming to the at least one channel and exposed to a bottom surface of the semiconductor package is formed. A semiconductor die is electrically connected to the conductive patterns. An encapsulant is used to at least partially filling the at least one channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.