Semiconductor device for an ultra wideband standard for ultra-high-frequency communication, and method for producing the same
US7945231B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2007 |
| Grant date | May 17, 2011 |
| Priority date | — |
| Expiry date | Jul 30, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device for an ultra-wideband standard for ultra-high-frequency communication includes an ultra-wideband semiconductor chip and a multilayer circuit substrate with at least one lower metal layer and one upper metal layer, in which an ultra-wideband circuit with passive devices is arranged. The lower metal layer has external contact pads on which external contacts are arranged, via which the semiconductor device can be surface-mounted on a circuit board. In addition, the semiconductor device has an antenna which is operatively coupled to the ultra-wideband semiconductor chip via the circuit on the circuit substrate and is arranged above the semiconductor chip and the circuit substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.