Thermocouple
US7946762B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 17, 2008 |
| Grant date | May 24, 2011 |
| Priority date | — |
| Expiry date | Jul 14, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K13/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermocouple for use in a semiconductor processing reactor is described. The thermocouple includes a sheath having a measuring tip at one end and an opening at the other end. A support member having bores formed along the length is disposed within the sheath. A pair of wires formed of dissimilar metals are disposed within the bores, and one end of the wires is fused together to form a junction. The wires extend along the length of the bores. As the wires exit the bore, they are spatially or physically separated to prevent a short circuit therebetween. The ends of the wires exiting the bore are also free to thermally expand in the longitudinal manner, thereby reducing or eliminating the potential for the wires to fail due to grain slip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.