Recessed gate silicon-on-insulator floating body device with self-aligned lateral isolation
US7947543B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 25, 2009 |
| Grant date | May 24, 2011 |
| Priority date | — |
| Expiry date | Sep 25, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2257
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of a manufacturing process for recessed gate devices on silicon-on-insulator (SOI) substrate with self-aligned lateral isolation are described. This allows the creation of true in-pitch recessed gate devices without requiring an extra isolation dimension. A lateral isolation trench is formed between pairs of recessed gate devices by etching the silicon-on-insulator area down to a buried oxide layer on which the silicon-on-insulator layer is formed. The position of the trench is self-aligned and defined by the gate width and the dimension of spacers disposed on either side of the gate. The isolation trench is filled with a dielectric material and then etched back to the middle of the SOI body and the remaining volume is filled with a doped conductive material. The doped conductor is subject to a thermal cycle to create source and drain regions of the device through out-diffusion of the doped material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.