Heat treatment apparatus, heat treatment method, and recording medium recording program for practicing the method
US7947926B2 · kind B2 · utility
1Cited by
0References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2007 |
| Grant date | May 24, 2011 |
| Priority date | — |
| Expiry date | Mar 23, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67126
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a heat treatment method in which a semiconductor wafer is carried into a heat treatment chamber constituted of a heat plate and a cover body covering the heat plate and processed, until the wafer is carried into the heat treatment chamber, an opening and closing operation of the cover body is performed to maintain the accumulated heat temperature of the heat treatment chamber at a prescribed processing temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.