Dielectric film and layer testing
US7948259B2 · kind B2 · utility
1Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2010 |
| Grant date | May 24, 2011 |
| Priority date | — |
| Expiry date | Oct 5, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/34
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for testing and a method for making a semiconductor device is disclosed. A preferred embodiment includes a conductor overlying a dielectric layer. The conductor is coupled to a first test pad via a first conducting line and to a second test pad via a second conducting line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.