Temperature compensation in memory devices and systems
US7948793B2 · kind B2 · utility
5Cited by
4References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2008 |
| Grant date | May 24, 2011 |
| Priority date | — |
| Expiry date | Jun 9, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C17/18
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Devices, methods, and systems for temperature compensation in memory devices, such as resistance variable memory, among other types of memory are included. A memory device can include a table with an output that is used to create a multiplication factor for a current to compensate for temperature changes in the memory device, where the output depends on an operating temperature of the memory device and a difference in the current between a highest specified operating temperature and a lowest specified operating temperature of the memory device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.