Method for forming bump of probe card
US7951302B2 · kind B2 · utility
0Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2007 |
| Grant date | May 31, 2011 |
| Priority date | — |
| Expiry date | Jan 28, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R3/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for forming a bump of a probe card is disclosed. In accordance with the method, a bump having a high aspect ratio for supporting a probe tip and a probe beam is formed using a semiconductor substrate as a mold eliminating a need for a photoresist film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.