Patent · US Active

Interconnections for integrated circuits

US7951703B2 · kind B2 · utility

1Cited by

3References

9Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Klaus Goller · Dresden, DE
Roland Wenzel · Munich, DE

Key dates

Filing date	Jun 30, 2009
Grant date	May 31, 2011
Priority date	—
Expiry date	Nov 28, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An interconnect connection structure having first and second interconnects and multiple connection elements that electrically connect the first interconnect to the second interconnect is described. The multiple connection elements are formed laterally in a lateral region of the first and second interconnects relative to an overlay orientation of the interconnects. A central region may be free of connection elements so that electro-migration properties of the connection structure are improved and the current-carrying capacity is increased.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.