Scribe line layout design
US7952167B2 · kind B2 · utility
8Cited by
52References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2007 |
| Grant date | May 31, 2011 |
| Priority date | — |
| Expiry date | Oct 12, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A scribe line layout design to reduce the damage caused by sawing the wafer is presented. An embodiment comprises metal plates located within the scribe lines and at least partially within the junctions of the scribe lines. Each of these metal plates has one or more slots to help relieve the pressure. Alternatively, instead of metal plates, grooves that may be filled with metal could be placed into the scribe lines. These metal plates could also be used concurrently with a seal ring for better protection during sawing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.