Wafer grounding method for electrostatic clamps
US7952851B2 · kind B2 · utility
4Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2008 |
| Grant date | May 31, 2011 |
| Priority date | — |
| Expiry date | Apr 23, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck and method for clamping and de-clamping a workpiece is provided. The ESC comprises a clamping plate having a clamping surface, and one or more electrodes. An electric potential applied to the one or more electrodes selectively clamps the workpiece to the clamping surface. An arc pin operably coupled to the clamping plate and a power source provides an arc for penetrating an insulating layer of the workpiece. The arc pin is selectively connected to an electrical ground, wherein upon removal of the insulative layer of the workpiece, the arc pin provides an electrical ground connection to the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.