Methods of forming packaged micro-electromechanical devices
US7955885B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2009 |
| Grant date | Jun 7, 2011 |
| Priority date | — |
| Expiry date | Jun 5, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0118
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Methods of forming packaged micro-electromechanical devices include forming a first substrate having a micro-electromechanical device therein, which extends adjacent a first surface of the first substrate. A first surface of a second substrate is then bonded to the first surface of the first substrate, to thereby encapsulate the micro-electromechanical device within a space provided between the first and second substrates. Subsequent to bonding, a second surface of the second substrate is selectively etched to define at least one through-substrate opening therein, which exposes an electrode of the micro-electromechanical device. Thereafter, the through-substrate opening is filled with an electrically conductive through-substrate via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.