Coated thermal interface in integrated circuit die
US7955900B2 · kind B2 · utility
18Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2006 |
| Grant date | Jun 7, 2011 |
| Priority date | — |
| Expiry date | Nov 19, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Some embodiments of the invention include a coated thermal interface to bond a die with a heat spreader. The coated thermal interface may be used to bond the die with the heat spreader without flux. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.