Patent · US Active

Method for improved thickness repeatability of PECVD deposited carbon films

US7955990B2 · kind B2 · utility

22Cited by

32References

17Claims

0Family size

Assignee

Novellus Systems, Inc. · US

Inventors

Jon Henri · West Linn, US
Gishun Hsu · Fremont, US
Robert Sculac · Lake Oswego, US
Scott Stoddard · Sherwood, US

Key dates

Filing date	Dec 12, 2008
Grant date	Jun 7, 2011
Priority date	—
Expiry date	Jun 4, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/02271
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Provided herein are improved methods of depositing carbon-based films using acetylene as a precursor. The methods involve using a low-vapor pressure solvent, e.g., dimethylfluoride (DMF) to stabilize the acetylene and delivering the acetylene to a deposition chamber. The methods provide improved wafer-to-wafer thickness uniformity and increase the usable amount of acetylene in an acetylene source to over 95%.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.