MIM capacitor integration
US7956400B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 15, 2006 |
| Grant date | Jun 7, 2011 |
| Priority date | — |
| Expiry date | Jun 24, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/68
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated metal-insulator-metal capacitor is formed so that there is an extension portion of its top plate that does not face any portion of the bottom plate, and an extension portion of its bottom plate that does not face any portion of the top plate. Vias connecting the MIM capacitor plates to conductors in an overlying metallization layer are formed so as to contact the extension portions of the top and bottom plates. Etching of the via holes is simplified because it is permissible for the via holes to punch through the extension portions of the capacitor plates. The bottom plate of the MIM capacitor is inlaid. The top plate of the MIM capacitor may be inlaid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.