Forming a helical inductor
US7956713B2 · kind B2 · utility
9Cited by
14References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2007 |
| Grant date | Jun 7, 2011 |
| Priority date | — |
| Expiry date | Apr 25, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09645
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one embodiment, the present invention includes an apparatus having a substrate with vias extending between first and second surfaces thereof, and at least one helical inductor adapted within a via, which may be formed of a conductive material. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.