Method for cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel
US7957137B2 · kind B2 · utility
23Cited by
35References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 2, 2009 |
| Grant date | Jun 7, 2011 |
| Priority date | — |
| Expiry date | Nov 2, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The method also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The method further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.