Phase change material containing fusible particles as thermally conductive filler
US7960019B2 · kind B2 · utility
15Cited by
18References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2007 |
| Grant date | Jun 14, 2011 |
| Priority date | — |
| Expiry date | Jul 31, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2982
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An electronic assembly having a microelectronic die, a heat spreader and a heat sink. A first thermal interface material is disposed between the microelectronic die and the heat spreader. A second thermal interface material is disposed between the heat spreader and a heat sink. The first and second interface materials each comprising a phase change polymer, a solderable material and a plurality of thermally conductive non-fusible particles. The solderable material interconnecting the non-fusible particles to form a plurality of columnar structures within the phase change polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.