Load lock design for rapid wafer heating
US7960297B1 · kind B1 · utility
28Cited by
35References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2006 |
| Grant date | Jun 14, 2011 |
| Priority date | — |
| Expiry date | Nov 20, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67248
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor processing tool heats wafers using radiant heat and resistive heat in chamber or in a load lock where pressure changes. The wafers are heated in greater part with a resistive heat source until a transition temperature or pressure is reached, then they are heated in greater part with a radiant heat source. Throughput improves for the tool because of the wafers can reach a high temperature uniformly in seconds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.