Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package
US7963021B2 · kind B2 · utility
2Cited by
3References
2Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 8, 2008 |
| Grant date | Jun 21, 2011 |
| Priority date | — |
| Expiry date | Jan 2, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An inductor embedded in a substrate, including a substrate, a coil electrode formed by filling a metal in a spiral hole formed on the substrate, an insulation layer formed on the substrate, and an external connection pad formed on the insulation layer to be connected to the coil electrode. The inductor-embedded substrate can be used as a cap for a micro device package by forming a cavity on its bottom surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.