Copper CMP slurry composition
US7964005B2 · kind B2 · utility
0Cited by
34References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2004 |
| Grant date | Jun 21, 2011 |
| Priority date | — |
| Expiry date | Jan 21, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A composition that rapidly passivates copper-containing surface to yield a uniform layer of insoluble copper oxide, the composition being useful in chemical-mechanical planarization of copper-containing surfaces is disclosed. The composition is a solution having a pH of equal to or greater than 9 and having an oxidation potential sufficient to oxidize the surface to form non-soluble copper oxides. Also disclosed are methods of making and using the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.