Electronic device package with electromagnetic compatibility (EMC) coating thereon
US7964936B2 · kind B2 · utility
2Cited by
0References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2008 |
| Grant date | Jun 21, 2011 |
| Priority date | — |
| Expiry date | Sep 13, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
Abstract
Electronic device packages with electromagnetic compatibility (EMC) coating thereon are presented. An electronic device package includes a chip scale package having a CMOS image sensor (CIS) array chip and a set of lenses configured with an aperture. An encapsulation is molded overlying the chip scale package. A shield is atop the encapsulation. A frame fixes the set of lenses to the encapsulation. An electromagnetic compatibility (EMC) coating is formed on the encapsulation to prevent electromagnetic interference.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.